The Bond Entrance Scholarship is applicable to all local and international students who apply for admission to Bond secondary school in the 2020/2021 academic year. It is awarded to any student with superior academic ability, and the student has made considerable contributions to their previous school and community.

Scholarship application process:

  1. The applicant fills in the scholarship application form and submits to Bond Admissions Department together with relevant application materials at least 30 days before enrollment.
  2. The Bond Scholarship Committee will review the applications background and materials received and make a decision. The scholarship amount ranges from $500-$2000.
  3. Qualified students will be notified and received the award after enrollment

The assessment will be based on: