The Bond Entrance Scholarship is applicable to all local and international students who apply for admission to Bond secondary school in the 2021/2022 academic year. It is awarded to any student with superior academic ability, and the student has made considerable contributions to their previous school and community.
Scholarship application process:
- The applicant fills in the scholarship application form and submits to Bond Admissions Department together with relevant application materials at least 30 days before enrollment
- The Bond Scholarship Committee will review the applications background and materials received and make a decision. The scholarship amount ranges from $500-$2000
- Qualified students will be notified and received the award after enrollment
The assessment will be based on: